Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Innovative approaches to the design of a high-performance package module accommodating a 32× 32 array of surface-active devices indium bump bonded to a 8× 8 mm2 VLSI chip are presented. Electrical, thermal and optomechanical design considerations are discussed and experimental performance results of a prototype implementation are described. The package module supports 139 impedance-controlled signal connections as well as active temperature stabilization of the optoelectronic VLSI chip. The package module is compact, simple to assemble, alignment-tolerant and can be passively inserted into a free-space optical system with no need for further adjustments.